Heat transfer and fluid flow in microchannels have been topics of intense research in the
past decade. A critical review of the current state of research is presented with a focus on the …

3-D sequential integration stands out from other 3-D schemes as it enables the full use of the
third dimension. Indeed, in this approach, 3-D contact density matches with the transistor …

In the past decade, monolithic three dimensional integrated circuits (M3D-ICs) advance fast
and demonstrate several important breakthroughs in the fabrication process and circuit level …

The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …

In this paper, we review some of the novel emerging memory technologies and how they
can enable energy-efficient implementation of large neuromorphic computing systems. We …

The ever‐increasing power density is a major trend for electronics applications from dense
computing to 5G/6G networks. Joule heating and resulting high temperature in the device …

Monolithic 3-D (M3-D) integrated circuits (ICs) provide vertical interconnects with
comparable size to on-chip metal vias, and therefore, achieve ultra-high density device …

To realize a stackable complementary metal–oxide–semiconductor field-effect transistor
(CMOSFET) on interlayer dielectrics for three-dimensional (3D) large-scale-integration …

In this paper we study the power vs. performance tradeoff in block-level monolithic 3D IC
designs. Our study shows that we can close the power-performance gap between 2D and a …

A processor laid out vertically in stacked layers can benefit from reduced wire delays, low
energy consumption, and a small footprint. Such a design can be enabled by Monolithic 3D …