A new technological approach is needed for the development of emerging electronic
components and systems within the Internet of Things (IoT) era. New advancements and …

We present in this paper design considerations and implementation challenges of a
proposed versatile SoC/SiP sensor interface intended for industrial applications. The …

System in Package (SiP) is widely used to miniaturize electronic systems and increase their
level of integration. Since reliability and lifetime estimation depend critically on accuracy of …

This paper proposes a real-time thermal monitoring method using embedded integrated
sensor interfaces dedicated to industrial integrated system applications. Industrial sensor …

This paper evaluates the thermal and thermo-mechanical behavior of a packaged sensor
interface embedding several high and low-voltage integrated circuits (ICs). The main …

In this paper, we propose a thermal profile based on the finite element method (FEM). The
proposed model is used to predict the temperature profile of the Xilinx™ SPARTAN-3E Field …

A novel non-overlapping signal generator intended for power-converters operation is
presented. This switched capacitor circuit architecture-based sensor and actuator interface …

This paper presents a systematic approach for Zeta power converter control, a versatile
solution designed for systems where the power supply is prone to fluctuations. The …

A CMOS Hall-based fully integrated isolation amplifier for differential voltage sensing is
presented in this work. The design is fabricated in a CMOS process in which the high …

A novel level down shifter intended for translation of signals with different amplitudes in
System-on-Chip (SoC) applications is presented. This new single supply down-shifter …