A monolithic integration of phase change material (PCM) switches with a MEMS resonator is
provided to implement switching and reconfiguration functionalities. MEMS resonator …

An RF switch is provided with a direct heating method. The RF switch is comprised of two RF
electrodes disposed on opposing sides of a phase change element. Depending on the state …

In one embodiment, a ruggedized wafer level microelectro mechanical (“MEMS”) force
sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane …

US9902611B2 - Miniaturized and ruggedized wafer level MEMs force sensors - Google Patents
US9902611B2 - Miniaturized and ruggedized wafer level MEMs force sensors - Google Patents …

US9487388B2 - Ruggedized MEMS force die - Google Patents US9487388B2 - Ruggedized
MEMS force die - Google Patents Ruggedized MEMS force die Download PDF Info Publication …

HOIL 2L/306(2006.01)(57) ABSTRACT B8IB 3/00(2006.01) A composite wafer level MEMS
force dies including a B8IC I/00(2006.01) spacer coupled to a sensor is described herein …

An example MEMS force sensor is described herein. The MEMS force sensor can include a
cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can …

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including
both piezoresistive and piezoelectric sensing elements and integrated with comple mentary …

Described herein is a MEMS force sensor with stress concentration design. The stress
concentration can be per formed by providing slots, whether through or blind, and/or …

Described herein is a ruggedized microelectromechanical (“MEMS”) sensor including both
fingerprint and force sensing elements and integrated with complementary metal-oxide …