Study on the wettability of Sn/Cu system under ultrasonic vibration
X Sun, W Yu, B Wu, W Zhu - Materials Today Communications, 2024 - Elsevier
In this study, the wetting behavior of Sn solder on Cu substrate under ultrasonic vibration
using the sessile drop method was investigated. The distribution of the vibration field on the …
using the sessile drop method was investigated. The distribution of the vibration field on the …
Ultrafast High-Temperature Non-Equilibrium Surface High-Entropy Metalization To Relieve Residual Stress Enhancing High-Temperature Performance of …
P Li, Y Chen, Z Zhang, T Zhang, L Qiao, Y Yan… - Available at SSRN … - papers.ssrn.com
To solve the problems of high residual stress and weak high-temperature performance in the
brazing of C/SiC composites and Nb heterogeneous components brazed by AgCuTi filler …
brazing of C/SiC composites and Nb heterogeneous components brazed by AgCuTi filler …