Effective thermal management is critical for optimising device performance, extending
product longevity, saving energy, protecting the environment, and avoiding thermal failures …

Flow boiling technology is considered one of the most promising cooling solutions for high
power microelectronics. However, flow boiling instabilities cause serious reliability problems …

Heat sinks that cool electronic systems through flow boiling are exposed to working fluids at
different inlet temperature. Therefore, in the present study, influence of inlet temperature on …

In this paper, nine Microchannel Heat sinks (MCHs) all with channel lengths of 20 mm and
heights of 1 mm but with different aspect ratios 1.33; 2 and 4, wall thicknesses 0.25–0.75 …

Flow boiling in microchannels shows high potential to cope with the high power density
dissipation for electronic devices. However, it is a challenge to promote the heat transfer …

With the advancement of artificial intelligence (AI) applications, there is a growing demand
for sophisticated and powerful chips. The adoption of these processors, along with …

In this study, heat transfer characteristics and dynamic flow boiling instabilities of ethanol
were investigated experimentally in a rectangular microchannel with 1000 μm wide, 200 μm …

Electronics cooling applications require a high cooling performance due to increasing power
consumption. Phase change heat transfer is a popular approach for offering high heat flux …

Maintaining temperature uniformity of the device is a crucial factor in reducing the risk of
local overheating and ensuring high performance stability. In this paper, we proposed a …

The increasing prevalence of high-performance computing data centers necessitates the
adoption of cutting-edge cooling technologies to ensure the safe and reliable operation of …