BACKGROUND The semiconductor integrated circuit (IC) industry has experienced
exponential growth. Technological advances in IC materials and design have produced …

An SEM image is acquired. The SEM image shows a metal line and a via hole disposed
above the metal line. The via hole exposes a portion of the metal line vertically aligned with …

A semiconductor device fabrication method includes irradiating a first surface of a substrate
with a radiation beam. While irradiating the first surface of the substrate, a precursor gas is …

2017-06-05 Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
reassignment TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. ASSIGNMENT OF …

A photoresist layer is formed over a wafer. The photoresist layer includes a metallic
photoresist material and one or more additives. An extreme ultraviolet (EUV) lithography …

An example embodiment of the present disclosure involves a method for semiconductor
device fabrication. The method comprises providing a structure that includes a conductive …

A method includes loading a mask having a defect into a chamber. The defect of the mask is
repaired by forming a repair feature in a repair region of the mask. The forming the repair …

BACKGROUND Semiconductor integrated circuit (IC) fabrication involves forming multiple
material layers with designed patterns on a semiconductor wafer. Those patterned material …

A system includes a digital pattern generator (DPG) having a plurality of pixels that are
dynamically and individually controllable; a switching device that is coupled to the DPG, the …

The present disclosure provides one embodiment of an IC method that includes receiving an
IC design layout including a first main feature and a second main feature; determining that …