Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics …

S Feng, L Du, Z Cui, X Zhu, X Fan, G Zhang… - Applied Surface Science, 2024 - Elsevier
Electromigration (EM) is a crucial failure mode in Aluminum (Al) interconnection wires those
are widely used in high density semiconductor packaging. This study systematically …

Decomposition of Dislocations in Magnesium Alloys

Z Li, J Tang, X Tian, Q Wang, W Jiang… - Acta Mechanica Solida …, 2022 - Springer
In this paper, molecular dynamics simulations are performed to investigate the
decomposition of ⟨ c+ a ⟩⟨ c+ a⟩ dislocations on both pyramidal-I and pyramidal-II planes …

Influence of local microstructure on the dislocation transference and micro-mechanical response in metastable fcc alloy

A Mandal, P Modak, M Sen, SB Singh… - Journal of Materials …, 2022 - Springer
This work underscores the effect of local microstructural configuration on the dislocation
movement and micro-mechanical behaviour in fine/ultra-fine-grained (< 2 μm), cold-rolled …