The threat of hardware reverse engineering is a growing concern for a large number of
applications. A main defense strategy against reverse engineering is hardware obfuscation …

Chemical–mechanical polishing (CMP) is the planarizing technique of choice to satisfy the
local and global planarity constraints imposed by advanced lithography methods. The …

In this paper, we investigate the crosstalk-induced delay, noise, and chemical mechanical
polishing (CMP)-induced thickness-variation implications of dummy fill generated using rule …

To reduce chip-scale topography variation in chemical mechanical polishing process,
dummy fill is widely used to improve the layout density uniformity. Previous researches …

Modern IC designs are exposed to a wide range of dynamic variations. Traditionally, a
conservative timing guardband is required to guarantee correct operations under the worst …

Metal fill patterning in modern IC processes forces many floating metal structures to exist in
the fabricated design. The number of these structures makes electrostatic capacitance …

A deep learning approach for the efficient electromagnetic analysis of an on-chip inductor
with dummy metal fillings (DMFs) is proposed. By comparing different activation functions …

Chemical-mechanical polishing (CMP), active and via fills have become indispensable
aspects of semiconductor manufacturing. CMP fills are used to reduce metal thickness …

As process technology continues to scale into the nanometer regime, the interplay between
dummy fill metal placement and interconnect thickness variation due to chemical …

In this paper, we investigate the crosstalk-induced delay and noise implications of floating
and grounded fill metal generated using each of the rule-based and model-based fill …