Silicon is the most widely used material in numerous fields. Traditional mechanical
machining methods have been unable to meet the higher requirements of processing …

After summing up the main physical properties of ZnO and its subsequent applications the
aim of this article is to review the growth of ZnO epitaxial films by PLD, MBE, MOCVD and …

We report on time-resolved measurements of the plasma evolution during metal ablation
with ultrashort laser pulses in the range from 200 fs to 3.3 ps. The plasma transmission …

Micromachining of silicon was conducted using a short-pulse (FWHM= 25ns) KrF (λ=
248nm) excimer laser that generates laser energy in the range of 100–480mJ. Laser …

Based on the concept of phase explosion, an enthalpy form of the two-step heating
equations is proposed to model the superheating and material ablation of metals caused by …

Silicon carbide (SiC) presents excellent semiconductor and physicochemical properties. The
fabrication of through-holes in SiC and SiC matrix composites is beneficial to the new …

Laser ablation micro-machining tests are conducted on silicon wafer, both in air and under
flowing water stream, with the use of 355nm-X AVIA laser. Effects of laser pulse frequency …

The use of a near ultraviolet Nd: YAG laser for rapid micromachining of sapphire and silicon
has been systematically investigated. Cutting, marking and surface ablation of both …

We show that ablation features in poly-methyl methacrylate (PMMA) induced by a single
femtosecond laser pulse are imposed by light polarization. The ablation craters are …

Laser drilling of single crystalline silicon carbide (SiC) wafer in air, under water, and under
methanol with a 355 nm wavelength laser is investigated and compared. Among these …