Ceramics and metals are both common materials applied in various industries, due to their
unique characteristics in terms of physicochemical and mechanical properties. Recently …

Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys
(Sn-x Cu, x= 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser …

Cu-based component/aluminum substrate solder joint is achieved through laser soldering
technology in this paper. The solder wettability on aluminum substrate and microstructure …

The thickness of Cusingle bondSn intermetallic compounds (IMCs) plays a crucial role in
determining the quality of laser soldering joints. However, there is a lack of research on laser …

Laser soldering has attracted attention as an alternative soldering process for micro-
soldering that minimizes the side effects of the conventional reflow soldering. In this study …

The random occurrence of component burn damage is a major challenge for laser soldering,
but the mechanism has not been clear. In order to find the reason, a new integrating sphere …

Bonding between the micro-LED chip and the substrate soldered joint has become a key
bottleneck after the mass transfer process of moving individual chips regarded as the …

Purpose This study aims to investigate the influence of different solder alloy materials on
passive devices during laser soldering process. Solder alloy material has been found to …

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical
properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser …

The effects of the sintering duration and powder fraction (Ag-coated Cu/SnAgCu) on the
microstructure and reliability of transient liquid phase sintered (TLPS) joints are investigated …