Smart or intelligent food packaging mainly based on colorimetric indicators or halochromic
sensors is preferred in recent years since these packaging films can effectively identify and …

Abstract Poly (para‐xylylene)(PPX) is a robust and biocompatible coating material that is
widely used in various applications, including electronics, aerospace and defense materials …

Poly-dichloro-para-xylylene (parylene-C) film is formed through a chemical vapor deposition
process, where monomeric gases are polymerized on the target surface at room …

Laser-induced graphene (LIG) has been extensively researched due to its facile fabrication
on various carbon-containing substrates using simple laser scribing. In recent years …

Embedded silicon fan-out packaging (eSiFO) features excellent electrical and thermal
performances as well as scalability to 3-D packaging and heterogeneous integration …

This paper reports a novel F-eSiFO fabrication strategy of flexible microsystems based on
the mature eSiFO (Embedded Silicon Fan-Out) technology. Heterogeneous dielets were …

Embedded Silicon Fan-out (eSiFO) packaging is considered one of the ideal advanced
packaging technologies due to its suitability for heterogeneous integration and its …

In this work, we report the catalytic application of magnetic core-shell Ni@ Cu nanoparticles
for dimethylamine borane (DMAB)-reduced electroless copper plating to fabricate flexible …