Advancements and challenges in ultra-thin vapor chambers for high-efficiency electronic thermal management: A comprehensive review

F Zhou, J Zhou, X Huai - International Journal of Heat and Mass Transfer, 2023 - Elsevier
Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

A review of small heat pipes for electronics

X Chen, H Ye, X Fan, T Ren, G Zhang - Applied Thermal Engineering, 2016 - Elsevier
Heat pipes (HPs) have received considerable attention in recent decades, especially in the
field of cooling electronics, which requires the removal of added heat from an area of limited …

[图书][B] Handbook of porous media

K Vafai - 2015 - books.google.com
This third edition offers a comprehensive overview of the latest theories on flow, transport,
and heat-exchange processes in porous media. It also details sophisticated porous media …

Critical evaluation of additively manufactured metal lattices for viability in advanced heat exchangers

I Kaur, P Singh - International Journal of Heat and Mass Transfer, 2021 - Elsevier
The advantages offered by the stochastic metal foams when used in high-performance
compact heat exchangers is evident in the open literature. Recently, there has been a surge …

[HTML][HTML] A review of heat pipe technology for foldable electronic devices

MJ Gibbons, M Marengo, T Persoons - Applied Thermal Engineering, 2021 - Elsevier
The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and
Huawei Mate X (2019), require increased battery size and processor performance to drive …

Experimental study on thermal performance of ultra-thin heat pipe with a novel composite wick structure

F Yi, Y Gan, Z Xin, Y Li, H Chen - International Journal of Thermal Sciences, 2023 - Elsevier
The rapid advancement of high-performance electronic devices and high-capacity energy
storage has prompted the development of ultra-thin heat pipes with a higher heat transfer …

Nano-and microstructures for thin-film evaporation—A review

JL Plawsky, AG Fedorov, SV Garimella… - Nanoscale and …, 2014 - Taylor & Francis
Evaporation from thin films is a key feature of many processes, including energy conversion,
microelectronics cooling, boiling, perspiration, and self-assembly operations. The phase …

A review of liquid metal high temperature heat pipes: Theoretical model, design, and application

Z Tian, C Wang, K Guo, D Zhang, GH Su, W Tian… - International Journal of …, 2023 - Elsevier
Adopting liquid metals as the working fluid, high temperature heat pipes (HTHPs) can
operate at a high temperature above 750 K and have extremely high heat transfer capacity …

Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures

R Wen, S Xu, YC Lee, R Yang - Nano Energy, 2018 - Elsevier
Thermal management of high power electronic systems such as advanced lasers, light
emitting diodes, radars, microprocessors, electrical machines, and power inverters, is …

Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances

MM Nahar, B Ma, K Guye, QH Chau, J Padilla… - Applied Thermal …, 2021 - Elsevier
Evaporation of liquid is important in a diverse range of engineering applications, such as ink-
jet printing, pesticide spraying, micro-and nanofabrication, thin-film coatings, biochemical …