[HTML][HTML] Terahertz metadevices for silicon plasmonics
Metamaterial devices (metadevices) have been developed in progress aiming to generate
extraordinary performance over traditional devices in the (sub-) terahertz (THz) domain, and …
extraordinary performance over traditional devices in the (sub-) terahertz (THz) domain, and …
On-chip sub-terahertz surface plasmon polariton transmission lines in CMOS
A low-loss and low-crosstalk surface-wave transmission line (T-line) is demonstrated at sub-
THz in CMOS. By introducing periodical sub-wavelength structures onto the metal …
THz in CMOS. By introducing periodical sub-wavelength structures onto the metal …
An energy-efficient and low-crosstalk sub-THz I/O by surface plasmonic polariton interconnect in CMOS
Traditional TEM-based I/O communication through either PCB traces or free space has
significant path loss and electromagnetic (EM) interferences that are hardly employed …
significant path loss and electromagnetic (EM) interferences that are hardly employed …
A 161-mW 56-Gb/s ADC-based discrete multitone wireline receiver data-path in 14-nm FinFET
This article introduces a wireline receiver (RX) data-path employing discrete multi-tone
(DMT) modulation for communicating over electrical links. The DMT RX incorporates a fully …
(DMT) modulation for communicating over electrical links. The DMT RX incorporates a fully …
[PDF][PDF] Miniaturized Photonic and Microwave Integrated Circuits Based on Surface Plasmon Polaritons.
PH He, HC Zhang, JW Zhu, M Hu… - Progress In …, 2022 - academia.edu
Photonic integrated circuits (PICs) and microwave integrated circuits (MICs) have been
widely studied, but both of them face the challenge of miniaturization. On one hand, the …
widely studied, but both of them face the challenge of miniaturization. On one hand, the …
A mmWave folded substrate integrated waveguide in a 130-nm CMOS process
MS Mahani, GW Roberts - IEEE Transactions on Microwave …, 2017 - ieeexplore.ieee.org
A miniaturized millimeter-wave substrate integrated waveguide (SIW) in IBM 130-nm digital
CMOS process is presented in this paper. The footprint of the interconnect is reduced …
CMOS process is presented in this paper. The footprint of the interconnect is reduced …
A wireless data transfer by using a patch antenna for biomedical applications
GS Byun - Electronics, 2022 - mdpi.com
In this paper, a 20 GHz wireless data transfer (WDT) interface for implantable applications is
proposed. The proposed WDT utilizes a small-form factor off-chip antenna to transfer data …
proposed. The proposed WDT utilizes a small-form factor off-chip antenna to transfer data …
Hybrid NRZ/multi-tone serial data transceiver for multi-drop memory interfaces
K Gharibdoust, A Tajalli… - IEEE Journal of Solid …, 2015 - ieeexplore.ieee.org
A 7.5 Gb/s mixed NRZ/multi-tone (NRZ/MT) transceiver for multi-drop bus (MDB) memory
interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity …
interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity …
An energy efficient and low cross-talk CMOS sub-THz I/O with surface-wave modulator and interconnect
Free-space EM-wave based GHz interconnect has significant loss and crosstalk that cannot
be deployed as low-power and dense I/Os for future network-on-chip (NoC) integration of …
be deployed as low-power and dense I/Os for future network-on-chip (NoC) integration of …
On the design of low-power hybrids for full duplex simultaneous bidirectional signaling links
C Yuan, A Naguib, S Shekhar - IEEE Transactions on Circuits …, 2020 - ieeexplore.ieee.org
This paper investigates the suitability of full duplex simultaneous bidirectional (FD-SBD)
signaling as a method to theoretically double the aggregate data transfer per pin for ultra …
signaling as a method to theoretically double the aggregate data transfer per pin for ultra …