Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
Effective heat dissipation of semiconductor devices is crucial for their extended lifespan and
operational stability, and the interface of semiconductors provides an effective window for …
operational stability, and the interface of semiconductors provides an effective window for …
Nanosecond UV laser and micro-grinding on copper-based diamonds for electronic packaging
H Xiao, Z Li, X Chen, J Liu, L Ran, N Chen - Ceramics International, 2024 - Elsevier
Copper-based diamonds have the advantages of high thermal conductivity and a thermal
expansion coefficient that matches that of chips, and they are widely used in various …
expansion coefficient that matches that of chips, and they are widely used in various …
Tailoring intrinsic properties for tetrahedral carbon/copper composites construction via electronic interface engineering
X Xing, H Jiang, Z Cui, S Zhang, Q Yang, D Wang… - Surfaces and …, 2024 - Elsevier
The electronic structure induced interface properties are important for active control of the
advanced equipment performance. Nevertheless, it is difficult to reveal the intrinsic …
advanced equipment performance. Nevertheless, it is difficult to reveal the intrinsic …
Abnormal Enhancement of Interfacial Thermal Conductance by Introducing Carbon Vacancy at the Cu/Diamond Interface
Effective heat dissipation of semiconductor devices is crucial for their extended lifespan and
operational stability, and the interface of semiconductors provides an effective window for …
operational stability, and the interface of semiconductors provides an effective window for …