Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

Abstract Cu/55 vol% diamond (Ti) composites are prepared by hot forging of cold-pressed
powder preforms, consisted of pure Cu powders and 50 nm-thick Ti-coated diamond …

Over the past few decades, significant progress has been made in micro-and nanoscale
heat transfer. Numerous computational methods have been developed to quantitatively …

This review introduces relevant nanoscale thermal transport processes that impact thermal
abatement in power electronics applications. Specifically, we highlight the importance of …

Tuning interfacial thermal conductance has been a key task for the thermal management of
nanoelectronic devices. Here, we study how the interfacial thermal conductance is greatly …

Heat dissipation through interfaces becomes challenging in nanodevices which impedes the
dissipation of waste heat. Accordingly, effective approaches are needed to optimize …

Interfacial thermal transport has become a significant bottleneck in thermal management,
particularly for the electronic high-power devices represented by III-V semiconductor …

It is proven that introduction of graphene into typical heterostructures can effectively reduce
the high interfacial thermal resistance in semiconductor chips. The crystallinity of graphene …

In this paper, AlN ceramic was directly joined to copper without active brazing filler metal. By
exerting the nanosecond laser irradiation on the AlN surface, the AlN ceramic was thermally …