High-density integration and fast processing speed in the semiconductor industry have
increased heat generation in electronic devices. Underfill materials, known for their high …

This paper is concerned with the modeling of the formation and growth of InterMetallic
Compound (IMC) layers in tin (Sn) based solder bumps on copper (Cu) interconnects within …

The ever increasing power density in modern semiconductor devices requires heat
dissipation solution such as heat sink to remove heat away from the device. A compressive …

Purpose–The purpose of this paper is to assess the thermo-mechanical reliability of a solder
bump with different underfills, with the evaluation of different underfill materials. As there is …

Thermal fatigue damage of flip chip solder joints is a serious reliability concern, although it
usually remains tolerable with the flip chip connections (of smaller chips) to organic boards …

In this work CPI induced mechanical stress for 3D stacks and 3D interposer packages is
studied. The stress built during package assembly has been obtained using finite element …

In this paper, penetration capability and stress behavior of capillary underfill (CUF) is
discussed. The constituent materials of the CUF characterize both the liquid state and the …

Creep deformation on solder plays important role in life time of an electronic package.
Traditionally, mechanical properties of solders have been tested using bulk solder samples …

The demands for a high-density, high-speed, and smaller integrated circuit have resulted in
3D stacked packages with through-silicon via (TSV) technology. Due to their sophisticated …

Abstract In 1964, Gordon Moore summarized the tendency that described the growth of
electronic packages' capacity and integration. Ever since its statement, the Moore's Law has …