The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …

Ag nanopaste is one of the most promising die-attach materials in power devices. In this
work, robust sintered SiC devices are achieved by using graphene reinforced Ag nanopaste …

Bondline thickness effect on fracture behaviors and cohesive zone model (CZM) is an
important topic for adhesive joints. In this paper, the fracture and CZM of sintered nano silver …

The booming development of electronic skins necessitates stretchable electrodes and
flexible sensors that exhibit distinctly opposite requirements of electromechanical properties …

The rising demand for increased integration and higher power outputs poses a hidden risk
to the long-term reliable operation of third-generation semiconductors. Thus, the power …

Achieving high strength and reliable bonding below 150° C using Ag nanoparticle pastes is
still a challenge. This work developed an organic-free nano-Ag multilayer film consisting of a …

It is of great interest but very difficult to achieve both rapid (few minutes) and low temperature
(< 200° C) sintering bonding using Cu nanoparticles, which is mainly due to the diffusion …

Simplifying the bonding technique used to package power devices is crucial for electric
vehicles and 5G communication. Herein, a transparent liquid Ag-based complex was …

Power semiconductor devices are the core components of power electronic systems and the
most fragile part. Power cycling tests and lifetime prediction models are the two main means …

Nanocrystalline metal films are emerging as die-attach materials for power electronic
packaging owing to their organic-free nature and capacity for low-temperature bonding. In …