Over the past decade, system-on-chip (SoC) designs have evolved to address the ever
increasing complexity of applications, fueled by the era of digital convergence …

Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-
chip communication bottleneck and improve performance over traditional two-dimensional …

BACKGROUND Circuit designers use electronic design automation (EDA) tools, a category
of computer aided design (CAD) tools, to design and lay out electronic circuits, including …

As application complexity continues to increase, multiprocessor systems-on-chip (MPSoC)
with tens to hundreds of processing cores are becoming the norm. While computational …

With power becoming a major constraint for multiprocessor embedded systems, it is
becoming important for designers to characterize and model processor power dissipation. It …

Design space exploration (DSE) at system level needs to cover all parameters and has to
find the best trade-off between performance and power of modern heterogeneous multi-and …

This book is based on my dissertation. Thus, it presents my work in the area of power
estimation at Electronic System Level as a research assistant of Professor Leupers at the …

In this paper, we introduce an integrated power methodology for multi-core SoC designs. It
features not only a bottom-up IP-based power modeling for all kinds of IP components …

In ultra-deep submicrometer (UDSM) technologies, the current paradigm of using copper
(Cu) interconnects for on-chip global communication is rapidly becoming a serious …

The requirement for higher reliability and availability of systems is continuously increasing
even in domains not traditionally strongly involved in such issues. Solutions are expected to …