Aiming at the problems of low processing efficiency and uneven material removal during
shear rheological polishing (SRP) of polycrystalline tungsten, this paper introduces the …

A sustainable photocatalyst for use with multiple purpose comprising demethylated lignin
(Fe3O4@ D‐wood) was made by treatment of wood and iron oxide. Characterization …

An ultrasonic chemical assisted polishing (UCAP) method exploiting the recombination
mechanism of ultrasonic vibration, Fenton oxidation and mechanical impact is proposed for …

Molybdenum (Mo) is a promising metal contact material to replace tungsten due to its low
electrical resistivity in sub-3 nm next-generation semiconductor processes. However, the …

Controlling: the composition of plasma-activated water by Cu ions - IOPscience Skip to content
IOP Science home Accessibility Help Search Journals Journals list Browse more than 100 …

Copper is involved in Alzheimer's disease (AD) where it appears to affect the aggregation of
amyloid-β (Aβ) and to catalyze the production of reactive oxygen species (ROS). Oxidative …

Global materials' and energy constraints and environmental issues call for a holistic
approach to waste upcycling. We propose a chemically rational, cost-effective and …

Chemical mechanical planarization (CMP) is indispensable for processing of integrated
circuit semiconductor devices to attain globally planarized surfaces. One of the critical …

Waterborne pathogens pose a lifelong threat, necessitating advanced disinfection systems
with state-of-the-art materials. Laser-Induced Graphene (LIG), a 3-dimensional form of …

In this study, an all-in-one poly (methyl methacrylate)(PMMA) device integrating two novel
techniques–DNA extraction employing a CuSO 4/H 2 O 2 system and DNA detection …