Methods of fabricating electronic and mechanical structures
DW Sherrer, DL Cardwell - US Patent 9,993,982, 2018 - Google Patents
The present invention relates to the fabrication of complicated electronic and/or mechanical
structures and devices and components using homogeneous or heterogeneous 3D additive …
structures and devices and components using homogeneous or heterogeneous 3D additive …
PCB-based prototyping of 3-D micromachined RF subsystems
N Jastram, DS Filipovic - IEEE transactions on antennas and …, 2013 - ieeexplore.ieee.org
A stacked printed circuit board (PCB) approach for prototyping 3-D microfabrication enabled
millimeter and submillimeter wave components and subsystems is proposed. To …
millimeter and submillimeter wave components and subsystems is proposed. To …
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
I Hovey, JR Reid, D Sherrer, W Stacy… - US Patent …, 2016 - Google Patents
US9306254B1 - Substrate-free mechanical interconnection of electronic sub-systems using a
spring configuration - Google Patents US9306254B1 - Substrate-free mechanical interconnection …
spring configuration - Google Patents US9306254B1 - Substrate-free mechanical interconnection …
Coaxial waveguide microstructures having conductors formed by plural conductive layers
DW Sherrer, JJ Fisher - US Patent 10,074,885, 2018 - Google Patents
Provided are coaxial waveguide microstructures. The microstructures include a substrate
and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a …
and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a …
Microfabricated broadband components for microwave front ends
ED Cullens - 2011 - search.proquest.com
Broadband components for microwave and millimeter-wave RF front ends enable increased
flexibility and functionality, such as using one front end for multiple electronic warfare …
flexibility and functionality, such as using one front end for multiple electronic warfare …
Batch fabricated microconnectors
DW Sherrer, J Rollin - US Patent 9,583,856, 2017 - Google Patents
US9583856B2 - Batch fabricated microconnectors - Google Patents US9583856B2 - Batch
fabricated microconnectors - Google Patents Batch fabricated microconnectors Download …
fabricated microconnectors - Google Patents Batch fabricated microconnectors Download …
Wafer scale test interface unit and contactors
RL Thompson, K Vanhille, AO Boryssenko… - US Patent …, 2019 - Google Patents
Devices and methods for multilayer packages, antenna array feeds, test interface units,
connectors, contactors, and large format substrates. The device comprising a 3D coaxial …
connectors, contactors, and large format substrates. The device comprising a 3D coaxial …
Multi-layer digital elliptic filter and method
JR Reid - US Patent 9,325,044, 2016 - Google Patents
US9325044B2 - Multi-layer digital elliptic filter and method - Google Patents US9325044B2 -
Multi-layer digital elliptic filter and method - Google Patents Multi-layer digital elliptic filter …
Multi-layer digital elliptic filter and method - Google Patents Multi-layer digital elliptic filter …
Substrate-free interconnected electronic mechanical structural systems
I Hovey, JR Reid, D Sherrer, W Stacy… - US Patent …, 2018 - Google Patents
US9888600B2 - Substrate-free interconnected electronic mechanical structural systems -
Google Patents US9888600B2 - Substrate-free interconnected electronic mechanical structural …
Google Patents US9888600B2 - Substrate-free interconnected electronic mechanical structural …
Devices and methods for solder flow control in three-dimensional microstructures
DW Sherrer, JR Reid - US Patent 9,505,613, 2016 - Google Patents
US9505613B2 - Devices and methods for solder flow control in three-dimensional
microstructures - Google Patents US9505613B2 - Devices and methods for solder flow control in …
microstructures - Google Patents US9505613B2 - Devices and methods for solder flow control in …