A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is
introduced for high‐yield and cost‐effective production of mini‐or micro‐light‐emitting diode …

We used simultaneous transfer and bonding (SITRAB) technology to fabricate a full‐color
Mini‐LED display on a flexible substrate. SITRAB technology is ETRI's patented technology …

We have transferred and bonded a μLED array to the patterned substrate using SITRAB
(Simultaneous transferring and bonding) and ASP (Anisotropic Solder Paste). ASP …

Micro/Mini-LED displays have many advantages compared to other displays. However, the
reliability data required for the commercialization of mini-LEDs is insufficient. In this study …

We transferred and bonded a Mini-LED array onto flexible substrates using the
simultaneous transfer and bonding (SITRAB) technology. We also developed the bonding …

Non-Conductive Paste (NCP) or Non-Conductive Film (NCF) materials are thermosetting
materials commonly employed to establish electrical interconnection between the bumps on …

For high-resolution display panels using mini-LEDs, high alignment accuracy and high yield
of LED transfer and bonding technology are very important parameters of packaging …

Anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) consisting of a
polymer matrix and a metal-coated polymer bead are introduced as interconnection …

In this study, we introduce the world's first development of a full‐color micro‐LED display
utilizing a Simultaneous Transfer and Bonding (SITRAB) process and a novel SITRAB film …

In this study, we present the development of a highly reliable 64× 64 Mini‐LED display,
where the LED array is transferred/bonded onto a glass substrate using SITRAB technology …