We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …

Sn whiskers are thin filaments that grow spontaneously out of the surface of coatings on Cu
and have become a critical reliability problem in Pb-free electronics. In this review, we focus …

In the present era of big data and internet of things, the use of microelectronic products in all
aspects of our life is manifested by the ubiquitous presence of mobile devices as i-phones …

As microelectronic industry develops 3D IC on the basis of through-Si-vias (TSV)
technology, the processing and reliability of microbumps, which are used to interconnect the …

Whisker publications from 1947 through 2004 are summarized and referenced in this
document. The bibliography listings are chronological (by publication year) while the …

Spontaneous whisker growth on beta-Sn is a creep phenomenon near a surface, driven by
compressive force. The compressive force is self-generated and the sample responses by …

The room temperature spontaneous growth of low melting point metal whiskers, such as Sn,
poses a serious reliability problem in the semiconducting industry; a problem that has …

The evolution of residual stress gradients in Sn thin films on Cu substrates upon aging at
ambient temperature has been investigated, for specimens which do exhibit and which do …

It has been shown experimentally that local in-plane residual strain gradients occur around
the root of spontaneously growing Sn whiskers on the surface of Sn coatings deposited on …

The 3D microstructure around a tin whisker, and its evolution during heat treatment were
studied using scanning 3DXRD. The shape of each grain in the sample was reconstructed …