Characterising solder materials from random vibration response of their interconnects in BGA packaging
Solder interconnection in electronic packaging is the weakest link, thus driving the reliability
of electronic modules and systems. Improving interconnection integrity in safety-critical …
of electronic modules and systems. Improving interconnection integrity in safety-critical …
Failure prediction and health prognostics of electronic components: A review
The Rapid evolution of electronics device technology towards low cost and high
performance, the electronics products become more complex, higher in density and speed …
performance, the electronics products become more complex, higher in density and speed …
Highly efficient and accurate algorithm for multiscale equivalent modeling and mechanical performance simulation of printed circuit boards
G Wan, Q Dong, X Sun, M Cheng, H Zheng… - Microelectronics …, 2023 - Elsevier
The increasing prevalence of reliability issues related to printed circuit boards (PCBs) has
led to significant interest in applying finite element analysis (FEA) for PCBs. This study …
led to significant interest in applying finite element analysis (FEA) for PCBs. This study …
Comparison of electronic component durability under uniaxial and multiaxial random vibrations
M Ernst, E Habtour, A Dasgupta… - Journal of …, 2015 - asmedigitalcollection.asme.org
Multiaxial and uniaxial vibration experiments were conducted in order to study the
differences in failure modes and fatigue life for the two types of excitation. An electrodynamic …
differences in failure modes and fatigue life for the two types of excitation. An electrodynamic …
Stress analysis of automotive IGBT module under vibration load
With the development of new energy vehicles, its control component (automotive IGBT
module) has met new opportunities and challenges. Automotive IGBT modules are in severe …
module) has met new opportunities and challenges. Automotive IGBT modules are in severe …
A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test
D Xie, A Zhang, B Kelly, J Lee… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
This paper describes two types of test vehicles including PCB with 77x77mm 2 and
140x140mm 2. The first TV is taken from drop test spec (JESD22-B111A) so that the same …
140x140mm 2. The first TV is taken from drop test spec (JESD22-B111A) so that the same …
Approach on the life-prediction of solder joint for electronic packaging under combined loading
A life-prediction approach of solder joints for electronic packaging under combined loading
is presented in this paper. The deformations of solder joints are calculated under vibration …
is presented in this paper. The deformations of solder joints are calculated under vibration …
Modeling the elastic behavior of an industrial printed circuit board under bending and shear
Industrial printed circuit boards (PCBs) are nonhomogeneous and anisotropic composites
consisting of copper traces, glass-reinforced epoxy laminate (FR-4), solder mask, vias, and …
consisting of copper traces, glass-reinforced epoxy laminate (FR-4), solder mask, vias, and …
Reliability assessment of preloaded solder joint under thermal cycling
The ever increasing power density in modern semiconductor devices requires heat
dissipation solution such as heat sink to remove heat away from the device. A compressive …
dissipation solution such as heat sink to remove heat away from the device. A compressive …
Fatigue properties of lead-free solder joints in electronic packaging assembly investigated by isothermal cyclic shear fatigue
This paper reports the fatigue properties of Sn-Ag-Cu (SAC) and Pb-Sn solder alloys
determined from isothermal shear fatigue testing and analysis of resulting data using …
determined from isothermal shear fatigue testing and analysis of resulting data using …