Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture
Cu/SiO2 hybrid bonding with planarized dielectric and isolated metal connections can
realize ultradense interconnects (eg,≤ 1 μm) by eliminating the microbumps and underfill …
realize ultradense interconnects (eg,≤ 1 μm) by eliminating the microbumps and underfill …
Efficient calculation of time-optimal motion primitives for systems exhibiting oscillatory internal dynamics with multiple applications
T Auer, F Woittennek - arXiv preprint arXiv:2411.19148, 2024 - arxiv.org
A fast algorithm for planning near time-optimal trajectories for systems with an oscillatory
internal dynamics has been developed in previous work. In this algorithm, trajectories are …
internal dynamics has been developed in previous work. In this algorithm, trajectories are …
Computationally efficient trajectory design from motion primitives for near time-optimal transitions for systems with oscillating internal dynamics
T Auer, F Woittennek - arXiv preprint arXiv:2411.19144, 2024 - arxiv.org
An efficient approach to compute near time-optimal trajectories for linear kinematic systems
with oscillatory internal dynamics is presented. Thereby, kinematic constraints with respect …
with oscillatory internal dynamics is presented. Thereby, kinematic constraints with respect …
On improving the settling time for highly-accurate pick-and-place processes with experimental validation
T Auer, F Woittennek - 2024 IEEE 20th International …, 2024 - ieeexplore.ieee.org
Parameter uncertainty in pick-and-place processes leads to inaccuracies due to oscillations
in the machine. There are several approaches to reduce the sensitivity to parameter …
in the machine. There are several approaches to reduce the sensitivity to parameter …
Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability
H Noma, M Takahashi, N Hatakeyama… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
A large silicon chip or interposer is mounted onto a large package substrate using flip-chip
for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation …
for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation …
On trajectory design for flexible structures with input and state constraints
T Auer, F Woittennek - IFAC-PapersOnLine, 2023 - Elsevier
Approaches to trajectory planning for lumped parameter models of flexible systems with
kinematic input and state constraints are compared. These comprise so-called impulse …
kinematic input and state constraints are compared. These comprise so-called impulse …