This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

This study compares high-speed bondtesting (shear and pull) with board level drop testing
(BLDT) of BGA packages using Sn4. 0% Ag0. 5% Cu solder balls and either an ENIG or …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

A detailed experimental study on the fracture mechanism of Cu–Sn intermetallic compounds
(IMCs) in the Pb-free solder was presented in this paper. The growth behaviors of the Cu 6 …

The chip-to-chip bonding technique using Cu-pillars bump is widely applied in 3D chip
stacking technology. The excessive growth of intermetallic compounds (IMC) is expected to …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

The dynamic response of a microsystem based on rigid-flex printed circuit board (rigid-flex
PCB) with three layers of rigid circuit boards connected by flexible circuits was investigated …

The reliability of an electronic product in harsh applications is typically limited by the fatigue
failure of one of the interconnected solder joints. Mechanical properties of common lead-free …