Slicing silicon wafers for solar cells and micro-electronic applications by diamond wire
sawing has emerged as a sustainable manufacturing process with higher productivity …

Diamond wire sawing (DWS) is the primary stage in the semiconductor industry for slicing
hard and brittle materials, delivering high surface quality with minimum kerf losses. Despite …

Considering the random distribution characteristics of diamond abrasive, a new evaluation
model of subsurface damage (SSD) depth is proposed for the solar silicon wafer processed …

Reducing the as-cut thickness of silicon wafers is one of the key issues to significantly lower
the manufacturing costs of the photovoltaic industry. The pursuit of this objective is …

A practical challenge in slicing of low-cost multi-crystalline silicon (mc-Si) wafers by the fixed
abrasive diamond wire sawing process is increased wire consumption due to greater wear …

The mechanical integrity of photovoltaic (PV) silicon wafers is critical to avoid failure during
solar cell manufacturing. Residual stress present in wafers affects mechanical integrity …

Ceramic matrix composites (CMC) are highly required in many fields of science and
engineering. However, the CMC parts always have poor surface finish. This study attempts …

Lower warp is required for the single crystal silicon wafers sawn by a fixed diamond wire
saw with the thinness of a silicon wafer. The residual stress in the surface layer of the silicon …