Development and challenges of reliability modeling from transistors to circuits

X Yang, Q Sang, C Wang, M Yu… - IEEE Journal of the …, 2023 - ieeexplore.ieee.org
The integration density of electronic systems is limited by the reliability of the integrated
circuits. To guarantee the overall performance, the integrated circuit reliability must be …

Quantum chemistry treatment of silicon-hydrogen bond rupture by nonequilibrium carriers in semiconductor devices

M Jech, AM El-Sayed, S Tyaginov, D Waldhör… - Physical Review …, 2021 - APS
The interaction of charge carriers with hydrogen-related defects plays a key role in modern
semiconductor applications. Particularly in the field of micro-and nanoelectronics, where …

A compact physics analytical model for hot-carrier degradation

S Tyaginov, A Grill, M Vandemaele… - 2020 IEEE …, 2020 - ieeexplore.ieee.org
We develop and validate a fully analytical model for hot-carrier degradation based on a
thorough description of the physical picture behind this reliability phenomenon. This …

Research on the thermal generation mechanism and transfer characteristics in the thermoelectric transport process of MOSFET power devices

M Zhang, Z He, D Yang, J Liao, Y Liu, L Li - International Journal of Heat …, 2025 - Elsevier
With the size down and integration of power devices, the internal thermal management
problem has become particularly severe. Especially in the channel region, significant heat …

Modeling of HCI effect in nFinFET for circuit reliability simulation

J Zhang, B Liu, H Chen, C Li, D Li, T Li, Y Lu… - Microelectronics …, 2024 - Elsevier
This paper proposes an equivalent circuit model for simulating the Hot Carrier Injection
(HCI) effect. This model is developed based on the N-FinFET in the 12 nm Process Design …

Physical principles of self-consistent simulation of the generation of interface states and the transport of hot charge carriers in field-effect transistors based on metal …

SE Tyaginov, AA Makarov, M Jech, MI Vexler, J Franco… - Semiconductors, 2018 - Springer
A detailed simulation of degradation (caused by hot charge carriers) based on self-
consistent consideration of the transport of charge carriers and the generation of defects at …

Macroscopic Transport Models for Classical Device Simulation

J Cervenka, R Kosik, M Jech, M Vasicek… - Springer Handbook of …, 2022 - Springer
We review macroscopic transport models as used in classical device simulation such as drift-
diffusion, hydrodynamic, and energy transport models. Using a systematic approach, these …

Impact of the device geometric parameters on hot-carrier degradation in FinFETs

SE Tyaginov, AA Makarov, B Kaczer, M Jech, A Chasin… - Semiconductors, 2018 - Springer
The effect of the geometric parameters of Fin field-effect transistors (FinFETs) on hot-carrier
degradation (HCD) in these devices is theoretically studied. To this end, a model is used, in …

Impact ionization and interface trap generation in 28-nm MOSFETs at cryogenic temperatures

X Yan, H Wang, H Barnaby… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
The characterization of impact-ionization (II) and stress-induced damage in 28-nm bulk n-
channel MOSFETs is used to identify the mechanisms for carrier-induced interface trap …

[PDF][PDF] Performance variation in digital systems: workload dependent modeling and mitigation

M Noltsis - 2021 - dspace.lib.ntua.gr
In this Chapter, we focus on the concept of performance variation in digital systems and
discuss its sources, mainly the interdependence with certain phenomena manifesting in the …