Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications

K Hu, Y Zhou, SK Sitaraman, MM Tentzeris - Scientific Reports, 2023 - nature.com
This paper thoroughly investigates material characterization, reliability evaluation,
fabrication, and assembly processes of additively manufactured flexible packaging and …

Flexible-to-stretchable mechanical and electrical interconnects

S Erlenbach, K Mondal, J Ma… - … Applied Materials & …, 2023 - ACS Publications
Stretchable electronic devices that maintain electrical function when subjected to stress or
strain are useful for enabling new applications for electronics, such as wearable devices …

Performance evaluation of RF novel microstrip lines printed on flexible substrates

AS Obeidat, M Alhendi, MY Abdelatty… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Additive manufacturing or direct write printing is an attractive way to fabricate electronics due
to potentially lower cost, volume production, fast turnout, and less generated waste. RF …

Stretchable Electrodes for Interconnects in Soft Electronics

J Jeon, JW Park - Nano letters, 2024 - ACS Publications
Soft electronics have significantly enhanced user convenience and data accuracy in
wearable devices, implantable devices, and human–machine interfaces. However, a …

Additively manufactured flexible on-package phased antenna arrays with integrated microfluidic cooling channels for 5G/mmwave system-on-package designs

K Hu, TW Callis, MM Tentzeris - IEEE Microwave and Wireless …, 2023 - ieeexplore.ieee.org
A fully additively manufactured flexible reconfigurable on-package antenna array with an
integrated microfluidic cooling channel is introduced. The proposed design is a multilayer …

Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

R Al-Haidari, M Alhendi, D Richmond… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Traditional device packaging becomes a limiting factor in realizing the full performance
potential of SiC. Thus, improved and advanced packaging technologies are required to …

SiC Power Module Packaging Using Printed Electronics Materials and Processes

R Al-Haidari, D Richmond, A Obeidat… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
Advanced packaging solutions for wide band-gap power devices such as SiC MOSFETs can
help realize their full potential. Additively printed electronics present a promising solution to …

Additive Manufacturing of Radio Frequancy (RF) Components on Flexible Substrates

AS Obeidat - 2022 - search.proquest.com
Additive manufacturing is an attractive technique in electronic fabrication due to material
savings and lower cost of processing. Microstrip lines are used for communication and …

Conformal Dry Electrode for ECG Monitoring

R Al-Haidari, B Falola, M Alhendi… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
This work reports the fabrication and testing of a conformal and soft dry electrode for
Electrocardiogram (ECG) monitoring to address the limitations associated with traditional gel …

Evaluation of Materials for the Design and Development of Sustainable Low-Cost Single-Use Electrode Leads for Wearable Medical Devices

B Falola, R Al-Haidari, ON Shamsian… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
Wearable medical devices have revolutionized continuous health monitoring, offering real-
time data collection and enhanced patient care. Among the crucial components, electrode …