This paper reviews the research and development works conducted over the past few
decades on carbon fiber reinforced metal matrix composites (CFR-MMC). The structure and …

With the increasing integration and miniaturization of electronic devices, heat dissipation
has become a major challenge. The traditional printed polymer circuit board can no longer …

Efficient thermal interface materials (TIMs) are urgently needed for heat dissipation of high-
power density electronics. In this study, vinyl polydimethylsiloxane (PDMS) composites with …

Continuous mesophase pitch-based carbon fiber (MPCF) reinforced aluminum (Al) matrix
composites were fabricated by vacuum hot pressing to meet the requirements of good …

Efficient thermal dissipation has become a critical factor limiting the development of
electronic devices. Thermal interface materials (TIMs) connecting the surfaces of heat …

Plastic-based electroluminescent devices generally suffer from thermal expansion owing to
the high coefficient of thermal expansion (CTE) of the plastic substrate, which reduces the …

We fabricated a uniformly dispersed and aligned multi-walled carbon nanotube reinforced
aluminum matrix (Al–MWCNT) composite with minimal work hardening and without …

The microstructure of graphite flake (GF) reinforced aluminum (Al) matrix (Al–GF)
composites was observed in detail. Due to thermal mismatch between Al and GF, an inner …

Al/graphite composites were prepared by spark plasma sintering (SPS) and hot extrusion
(HE). Two kinds of extrusion routes (with and without 90˚ rotation of the extrusion billets) …

Electroless nickel (Ni)-coated carbon fibers (CFs)/aluminum (Al) composites were prepared
by a hot-extrusion process. The effects of Ni-coating and extrusion temperature on …