The semiconductor industry is experiencing a significant shift from traditional methods of
shrinking devices and reducing costs. Chip designers actively seek new technological …

System-in-package (SiP) is a type of electronic packaging convention that integrates
multiple components, such as microprocessors, memory, sensors, and so on, in the form of …

The semiconductor industry is entering a new age in which device scaling and cost
reduction will no longer follow the decades-long pattern. Packing more transistors on a …

In this paper, first, a broad overview of existing covert channel communication-based
security attacks is provided. Such covert channels establish a communication link between …

Due to slowdown of Moore's law and Dennard scaling, modern hardware design has shifted
to heterogenous integration (HI) instead of traditional monolithic ICs. However, HI incurs its …

Accurate thermal analysis is essential for the design of reliable of system-in-package (SiP).
This paper proposes a transient thermal analysis of the SiP technology based on four chips …

Fully integrated DC-DC converters have become pivotal components in the evolution of
today's electronic landscape, especially in shaping the future of Internet of Things (IoT) …

This paper introduces the orthogonal rational approximation (ORA) algorithm for rational
function approximation of transfer functions, based on data available from simulations or …

The semiconductor industry has adopted heterogeneous integration (HI), incorporating
modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to …

With the limitations of Moore's Law and Dennard scaling in integrated circuits (ICs) on the
horizon, the concept of heterogeneous integration (HI) has gained significant traction as a …