[图书][B] Fundamentals of microfabrication: the science of miniaturization
MJ Madou - 2018 - books.google.com
MEMS technology and applications have grown at a tremendous pace, while structural
dimensions have grown smaller and smaller, reaching down even to the molecular level …
dimensions have grown smaller and smaller, reaching down even to the molecular level …
[图书][B] Fundamentals of microfabrication and nanotechnology, three-volume set
MJ Madou - 2018 - taylorfrancis.com
Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to
provide the most complete MEMS coverage available. Thoroughly revised and updated the …
provide the most complete MEMS coverage available. Thoroughly revised and updated the …
[图书][B] The RF and microwave handbook
M Golio - 2000 - taylorfrancis.com
The recent shift in focus from defense and government work to commercial wireless efforts
has caused the job of the typical microwave engineer to change dramatically. The modern …
has caused the job of the typical microwave engineer to change dramatically. The modern …
[图书][B] MEMS and MOEMS Technology and Applications
P Rai-Choudhury - 2000 - books.google.com
The silicon age that led the computer revolution has significantly changed the world. The
next 30 years will see the incorporation of new types of functionality onto the chip-structures …
next 30 years will see the incorporation of new types of functionality onto the chip-structures …
Challenges in the packaging of MEMS
CB O'Neal, AP Malshe, SB Singh… - … and Interfaces (IEEE …, 1999 - ieeexplore.ieee.org
Unlike IC packaging, MEMS dice must interface with the environment for sensing,
interconnection, and/or actuation. MEMS packaging is application specific and the package …
interconnection, and/or actuation. MEMS packaging is application specific and the package …
Challenges in the packaging of MEMS
AP Malshe, SB Singh, WP Eaton, C O'Neal, WD Brown… - 1999 - osti.gov
The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance
to anyone using or manufacturing sensors, consumer products, or military applications …
to anyone using or manufacturing sensors, consumer products, or military applications …
[图书][B] From MEMS to Bio-MEMS and Bio-NEMS: Manufacturing techniques and applications
MJ Madou - 2011 - taylorfrancis.com
From MEMS to Bio-MEMS and Bio-NEMS: Manufacturing Techniques and Applications
details manufacturing techniques applicable to bionanotechnology. After reviewing MEMS …
details manufacturing techniques applicable to bionanotechnology. After reviewing MEMS …
[图书][B] The simulation of thermomechanically induced stress in plastic encapsulated IC packages
G Kelly - 1999 - books.google.com
This book is motivated by the need to understand and predict the complex stress
distributions, transfer mechanisms, warpage, and potential failures arising from the …
distributions, transfer mechanisms, warpage, and potential failures arising from the …
Advanced multichip module packaging of microelectromechanical systems
JT Butler, VM Bright, JH Comtois - Proceedings of International …, 1997 - ieeexplore.ieee.org
Multichip module (MCM) packaging provides an efficient solution to integration of MEMS
with microelectronics. In this paper, new methods of packaging MEMS using two advanced …
with microelectronics. In this paper, new methods of packaging MEMS using two advanced …
Modularity and spacecraft cost
J Enright, C Jilla, D Miller - Journal of Reducing Space Mission Cost, 1998 - Springer
From computers to aeronautics, many industries have achieved great cost savings through
the use of modular engineering approaches. In standardizing interfaces between elements …
the use of modular engineering approaches. In standardizing interfaces between elements …