In this work, back end of line (BEOL)-compatible amorphous indium–gallium–zinc oxide (a-
IGZO) transistors are monolithically stacked on top of first-layer a-IGZO-based analog/digital …

High-density interconnect (HDI) printed circuit boards (PCBs) are in high demand for
smartphones, particularly those with fifth generation (5G) functionality, due to their smaller …

This paper presents a next generation glass-based active interposer with 2 micron polymer
RDL. Passive 2.5 D interposers have become a mainstream solution to address the …

This work presents silicon reliability characterization of Intel's Foveros three-dimensional
(3D) logic-on-logic stacking technology implemented on the 22FFL process node …

Chiplet-based systems integrate discrete chips on an interposer and use the interconnection
network to enable communication between different components. The topology of the …

We present the design of a miniaturized probe integrating silicon photomultiplier and light-
pulsing electronics in a single 2× 2 mm 2 complementary metal-oxide-semiconductor …

The development of semiconductors, driven by artificial intelligence (AI) and fifth-generation
technology (5G) technologies, has posed challenges in advanced packaging. To address …

Die stacking is commonly used in memory modules. Solder micro-bumps and through
silicon via (TSVs) are common interconnects, and it may not viable or suitable for device that …

Advanced packaging solutions using Through Silicon Interposers (TSI) are an attractive
option to create 2.5 D ICs. In many applications such as GPU and FPGA, 2.5 D ICs can …

A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC
(PIC) are described here. These two platforms are capable to support high-speed integration …