This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

This review introduces our study on the development of Cu-based nanoparticles suitable as
fillers in the metal–metal bonding process. Colloid solutions of various nanoparticles such …

A novel die-attach material, Cu particle paste with self-reduction and self-protection
characteristics, was designed by simply adding ascorbic acid (AA) into Cu paste. The self …

Abstract Three kinds of Cu–Ag composite paste were fabricated. We used 10 μm Cu
particles as the main component of the paste as they are significantly cheaper than Ag and …

In this paper, new type Cu nanoaggregates (Cu NAs) were designed, and the Cu-Cu
bonding by Cu NAs was investigated. The Cu NAs were obtained by agglomeration of the …

A one-step polyol method was employed to synthesize bimodal Cu particles with average
diameters around 200 nm and 1000 nm, respectively. The bimodal Cu particles were mixed …

The development of WBG (wide bandgap) semiconductors has put forward higher
requirements for packaging and interconnection technology. Cu sintering is widely …

Abstract Background Cu-Cu direct bonding is a promising technology to construct a
temperature resistant bonding structure for emerging power devices and vehicle electronics …

Copper pastes suitable for low temperature and low pressure die-attach bonding were
developed to enable sintering at 275° C under N 2 atmosphere. First, brass flakes were …

To promptly form a bondline with high thermal stability and thermal conductivity using a
small amount of expensive Ag, dies were attached to Ag finishes by pressure-assisted sinter …