The evolution of silicon cryoetching is reported in this topical review, from its very first
introduction by a Japanese team to today's advanced technologies. The main advances in …

A method is provided for depositing a planarization layer over features on a substrate using
sequential polymerization chemical vapor deposition. According to one embodiment, the …

This paper presents an in-depth overview of the present status and novel developments in
the field of plasma processing of low dielectric constant (low-k) materials developed for …

Organosilicate glass (OSG) films are a critical component in modern electronic devices, with
their electrical properties playing a crucial role in device performance. This comprehensive …

Advanced Interconnects: Materials, Processing, and Reliability Page 1 ECS Journal of Solid State
Science and Technology, 4 (1) Y1-Y4 (2015) Y1 JSS Focus Issue ON Advanced Interconnects …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

The exceptional mechanical properties of polymer nanocomposites are achieved through
intimate mixing of the polymer and inorganic phases, which leads to spatial confinement of …

Reducing the delay of backend interconnects is critical in delivering improved performance
in next generation computer chips. One option is to implement interlayer dielectric (ILD) …

As demand for lower power and higher performance nano-electronic products increases, the
semiconductor industry must adopt insulating materials with progressively lower dielectric …

The increasing sensitivity of porous low dielectric constant materials to process damage
constitutes a major roadblock to their implementation in back-end-of-the-line (BEOL) wiring …