Water-based slurries with silica (SiO 2) nanoparticles, graphene oxide (GO) nanosheets and
GO/SiO 2 hybrid nanostructures as abrasives were synthesised in order to achieve a high …

Nanomachining of brittle materials is required in a wide range of applications. This paper
reports on the feasibility studies of vibration-assisted nano-impact machining by loose …

The effect of sanding, as the last operation before finishing, on the quality of heat treated
wood surfaces has been insufficiently explored and explained. This paper compared the …

The semiconductor industry has continued to increase the diameter of wafers in recent
years, which poses a challenge in the lapping of prime wafers as the processing time is …

Lapping appears like a miraculous process, because it can produce surfaces that are
perfectly flat, perfectly round, perfectly smooth, perfectly sharp, or perfectly accurate. Under …

为实现蓝宝石等硬脆材料的高效率, 低表面粗糙度研磨加工, 提出利用陶瓷结合剂和微细金刚石
磨料(粒径3 μm) 烧结制成聚集体金刚石磨料(平均粒径30 μm) 进行研磨加工新工艺. 通过与3 μm …

It is a currently dominant method to use wire saws for cutting silicon material because of its
production efficiency and energy efficiency. Diamond wire saws, or fixed abrasive wire saws …

The most essential problem in lapping process is low material removal rate which leads to
increase in production costs and time. Thus, in this process it is essential to select a …

[OBJECTIVES] Grinding is one of the ultraprecision machining methods for efficiently
thinning and flattening hard and brittle materials such as sapphire. However, traditional …

Lapping process is one of the most important finishing processes in order to achieve a flat
surface. In this paper, effects of parameters such as abrasive particle size, abrasive particles …