Conspectus Nanostructured copper-based materials have emerged as a new generation of
robust architectures for realizing high-performing and reliable interconnection in modern …

Sintered copper nanoparticles are being considered as alternatives to solder and/or sintered
silver in different applications. Like for the alternatives, the interpretation of accelerated …

Fused or sintered Cu nanoparticle structures are potential alternatives to solder for ultrafine
pitch flip chip assembly and to sintered Ag for heat sink attach in high-temperature micro …

For interconnections and packaging of electronics/microelectronics assemblies, the use of
Sn-rich solders, such as Sn–3.5 Ag or Sn3Ag0. 5Cu, has been proven to be a promising …

Conventional microelectronic interconnections are made using solder alloys, but the
demand for high performance interconnects is ever-increasing to meet challenges of …

Nanoporous (np) metals and alloys are a class of nanomaterials that exhibit a network of
interconnected pore-ligament structure with length scales ranging from single to tens of …