In a highly competitive market, reliable techniques for manufacturing quality control of
electronic devices are demanded. Characterisation of modern microelectronic package …

Acoustic microimaging (AMI) has been widely used to nondestructively evaluate
microelectronic packages for the presence of internal defects. To detect defects in small …

Solder connections provide an electrical and mechanical connection between components
and PCB (Printed Circuit Board) in electronic devices. It is very important to develop a …

As an efficient non-destructive checking technique, scanning acoustic microscopy has been
rapidly developed and widely used in nondestructive detection for composites, chip …

Acoustic microimaging (AMI) is used as an important non-destructive tool in semiconductor
reliability evaluation and failure analysis. As advanced microelectronic packages are being …

Scanning acoustic microscopy is an imaging method in which the focused high frequency
ultrasound is used to visualize the micro structures. The morphology and acoustic properties …

Advancements in integrated circuit (IC) package technology are increasingly leading to size
shrinkage of modern microelectronic packages. This size reduction presents a challenge for …

The introduction of BGA and flip-chip packages has made a large number of solder joints
invisible to optical inspection. X-ray inspection and acoustic micro imaging have both been …

The potential of the water-immersion and dry-contact acoustic imaging techniques for
detecting nanometer gaps embedded in silicon is studied. The sensitivity for detecting gaps …

Microscope (SAM) is a powerful tool for biological tissue characterization. Characterization
of thin sliced tissue is difficult, as the reflected signals from tissue top and bottom are …