[HTML][HTML] Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties
During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …
Recent advances on SnBi low-temperature solder for electronic interconnections
SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …
Evolution of interfacial IMCs and mechanical properties of Sn–Ag–Cu solder joints with Cu-modified carbon nanotube
B Chen, H Wang, M Zou, X Hu, W Chen… - Journal of Materials …, 2022 - Springer
Cu-modified carbon nanotube (Cu-CNT) was mechanical mixed with Sn-3.0 Ag-0.5 Cu
(SAC305) solder powder to fabricate composite solder. Experiments were carried out on the …
(SAC305) solder powder to fabricate composite solder. Experiments were carried out on the …
Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review
L Li, W Qin, B Mai, D Qi, W Yang, J Feng, Y Zhan - Crystals, 2023 - mdpi.com
Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced
soldering. They have excellent mechanical, electrical, and thermal properties and are …
soldering. They have excellent mechanical, electrical, and thermal properties and are …
Bending reliability of Ni–MWCNT composite solder with a differential structure
A carbon nanotube (CNT) has remarkable properties, but it has disadvantages in application
because of its dispersal-and bonding-related issues. Metal–CNT composite materials are …
because of its dispersal-and bonding-related issues. Metal–CNT composite materials are …
Surface modifications on ceramic reinforcement for tin-based composite solders
LW Keong, AA Mohamad, MFM Nazeri - Recent Progress in Lead-Free …, 2022 - Springer
This chapter aimed to provide a general overview of several surface modifications'
techniques of ceramic reinforcements on the properties of composite solders. It is commonly …
techniques of ceramic reinforcements on the properties of composite solders. It is commonly …
Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish
Mass reflow (MR) has been widely used in the interconnecting process of electronic
packaging. However, use of conventional MR shows a limitation in the miniaturization trend …
packaging. However, use of conventional MR shows a limitation in the miniaturization trend …
Mechanical and Corrosion Properties Investigation of Sn-9Zn Solder with the Additions of Nickel-Coated Precipitated Calcium Carbonate
LW Keong, AA Mohamad, MFM Nazeri - Proceedings of the 7th …, 2022 - Springer
Abstract The Sn-9Zn alloy is known to suffer from poor corrosion resistance. This study
investigates the changes in mechanical properties and corrosion resistance of this alloy with …
investigates the changes in mechanical properties and corrosion resistance of this alloy with …
Effect of Sn decorated MWCNT particle on microstructures and bonding strengths of the OSP surface finished FR-4 components assembled with Sn58% Bi composite …
Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys
because of various environmental regulations such as restriction of hazardous substances …
because of various environmental regulations such as restriction of hazardous substances …