With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer
electronic products, Sn–Ag–Cu series solder has been gotten the most application …

Indentation test using a cylindrical indenter with a flat end is now known as impression test.
The advantage is its capability to reach a steady state for creep test at constant load and it is …

Mechanical properties and indentation creep of the melt-spun process Bi–42wt% Sn, Bi–
40wt% Sn–2wt% In, Bi–40wt% Sn–2wt% Ag and Bi–38wt% Sn–2wt% In–2wt% Ag were …

Tensile deformation behavior of Sn–5Sb, Sn–5Sb–1.5 Bi, and Sn–5Sb–1.5 Cu alloys was
investigated at temperatures ranging from 298 to 400K, and strain rates ranging from 5× 10 …

Creep behavior of the Sn–5Sb–1.5 Bi, Sn–5Sb–1.5 Ag, and Sn–5Sb–1Ag–1Bi alloys was
studied by impression testing and compared to that of the Sn–5Sb base alloy. The tests were …

The influence of 1wt% Sb2O3 nanoparticles addition on the microstructure and mechanical
properties of Sn-3wt% Bi solder alloy has been investigated. X-ray diffraction (XRD) and …

Creep behavior of the tin-based lead-free Sn–2Bi, Sn–5Sb, and Sn–9Zn, binary alloys was
studied by the newly-developed shear punch creep testing (SPCT) technique in the …

Creep behavior of the ternary Sn-5Sb-1.5 Ag and Sn-5Sb-1.5 Bi alloys was studied by
indentation testing at 298 and 370 K, and compared to that of the binary Sn-5Sb base alloy …

Here we investigate the effects (thermal, microstructural, and creep properties) of adding
Sb2O3 nanoparticles to a hypoeutectic Sn-5 wt% Bi solder alloy. The Sb2O3-containing …

For optical packaging, there is a need to directly bond non-solderable materials such as
oxides, nitrides, borides and fluorides, which are very difficult to wet/bond with low melting …