This study investigated the material removal mechanism of sapphire wafer with soft-hard
mixed abrasives through mechanical chemical polishing (MCP). The polishing film, which …

The fixed agglomerated diamond abrasive pad had been used to planarize ultra-hard and
brittle materials such as sapphire and SiC. However, the processing stability and surface …

Fixed abrasive is taking the place of loose abrasive owing to its high efficiency and little
pollution. The self-conditioning ability of fixed abrasive pads (FAPs) plays a favorable role in …

Grinding executed in a lapping configuration is an alternative finishing process benefiting
from both grinding and free-abrasive machining, while minimizing the heat effect impact …

Current development of modern products, together with ever-increasing demands for their
operation and usage, necessitate the search for new processing methods. Abrasive …

Sapphire substrates with different orientations have wide applications due to their excellent
physical, chemical and optical properties. However, the chemical mechanical polishing of …

Chemical mechanical polishing (CMP) is currently the most widely used method for material
removal and surface planarization of glass. An environmentally friendly method of improving …

An artificial neural network (ANN) simulation was utilized to determine the lapping
parameters such as rotation speed, lapping duration and lapping pressure under a constant …

Lapping appears like a miraculous process, because it can produce surfaces that are
perfectly flat, perfectly round, perfectly smooth, perfectly sharp, or perfectly accurate. Under …

Microabrasive-based lapping is widely used in the manufacturing of single-crystal substrates
such as sapphire, SiC, and GaN. Although many studies have been conducted to improve …