Copper is the most common interconnecting material in the field of microelectronic
packaging, which is widely used in advanced electronic packaging technologies. However …

Abstract The Hall–Petch relationship σ y= σ 0+ kyd− 0.5 is widely used to describe the
relationship between yield strength and grain size of polycrystalline metals, and the material …

Extended defects, including exposed surfaces and grain boundaries (GBs), are critical to the
properties of polycrystalline solid electrolytes in all‐solid‐state batteries (ASSBs). These …

Polycrystalline α iron has been used in various applications, yet its microstructure design via
grain boundary engineering (GBE) is not well established. One limiting factor is that while …

Adoption of Li-ion batteries for stationary energy storage requires to prolong their
operational lifetimes to several decades calling to inhibit all degradation mechanisms. One …

We report the development of a fully automatic large-volume 3D electron backscatter
diffraction (EBSD) system (ELAVO 3D), consisting of a scanning electron microscope (ZEISS …

Three-dimensional orientation mapping in the transmission electron microscope (3D-
OMiTEM) has been used to characterize the grain structure of an ion-sputtered gold …

In this article, we review recent developments in the experimental study of grain growth in
nanocrystalline metallic thin films, emphasizing transmission electron microscopy-based …

The energies of 388 grain boundaries with a range of misorientations and grain boundary
plane orientations have been calculated using the meta-atom embedded atom method …

Describing microstructure evolution in tungsten requires a quantitative description of the
anisotropic grain boundary energy. We present a grain boundary energy function for …