Boundary scan chain for stacked memory
DJ Zimmerman - US Patent 8,645,777, 2014 - Google Patents
(57) ABSTRACT A boundary scan chain for stacked memory. An embodiment of a memory
device includes a system element and a memory stack including one or more memory die …
device includes a system element and a memory stack including one or more memory die …
Semiconductor chip module and semiconductor package having the same
TK OH, JS OH, KW Han, WS Lee… - US Patent App. 13 …, 2014 - Google Patents
A semiconductor chip module includes a first semiconductor chip having first through-
electrodes, a second semiconductor chip having second through-electrodes which are …
electrodes, a second semiconductor chip having second through-electrodes which are …
Boundary scan chain for stacked memory
DJ Zimmerman - US Patent 9,476,940, 2016 - Google Patents
A boundary scan chain for stacked memory. An embodiment of a memory device includes a
system element and a memory stack including one or more memory die layers, each …
system element and a memory stack including one or more memory die layers, each …
Multi-chip semiconductor apparatus
YO Kim - US Patent 9,165,860, 2015 - Google Patents
(57) ABSTRACT A multi-chip semiconductor apparatus includes a plurality of semiconductor
chips stacked and packaged therein, wherein each of the semiconductor chips includes: a …
chips stacked and packaged therein, wherein each of the semiconductor chips includes: a …
Characterizing TSV structures in a semiconductor chip stack
BACKGROUND 3-D semiconductor die stacking is an emerging and excit ing technology
which offers lower power consumption, reduced form factor and interface latency with …
which offers lower power consumption, reduced form factor and interface latency with …
Multi-chip semiconductor apparatus
YO Kim - US Patent 10,056,354, 2018 - Google Patents
A multi-chip semiconductor apparatus includes a plurality of semiconductor chips stacked
and packaged therein, wherein each of the semiconductor chips includes: a through-silicon …
and packaged therein, wherein each of the semiconductor chips includes: a through-silicon …
Boundary scan chain for stacked memory
DJ Zimmerman - US Patent 10,347,354, 2019 - Google Patents
A boundary scan chain for stacked memory. An embodiment of a memory device includes a
system element and a memory stack including one or more memory die layers, each …
system element and a memory stack including one or more memory die layers, each …
Detection of volatiles in personal care products
DDH Nhan, S Ranganathan, JM Gil… - US Patent App. 15 …, 2018 - Google Patents
Color-change compositions for detecting urine and feces volatiles include the following pH
indicator dyes: m-Cresol Purple, Basic Fuchsin, Brilliant Blue G, Brilliant Blue R, Cresol Red …
indicator dyes: m-Cresol Purple, Basic Fuchsin, Brilliant Blue G, Brilliant Blue R, Cresol Red …