Stability analysis of nanoscale copper-carbon hybrid interconnects

B Kumari, R Sharma, M Sahoo - 2022 IEEE 72nd Electronic …, 2022 - ieeexplore.ieee.org
Copper Carbon (Cu-Carbon) hybrid interconnect is a new and an extremely promising
candidate for future VLSI circuit applications, so it needs to be analyzed for not only …

Thermal-aware modeling and analysis of Cu-Mixed CNT nanocomposite interconnects

B Kumari, S Pandranki, R Sharma… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Growing only single-walled carbon nanotube (SWCNT) or only multi-walled carbon
nanotube (MWCNT) in a bundle is not feasible practically. Thus, a random number of …

Scattering-induced circuit modelling and performance analysis of coupled hybrid Interconnections: Sub-threshold performance evaluation

R Sidhu, MK Rai - Micro and Nanostructures, 2024 - Elsevier
This paper presents the scattering induced circuit modelling and performance analysis in
terms of crosstalk and frequency stability in the newly proposed hybrid interconnects …

Temperature and dielectric surface roughness dependent performance analysis of Cu-graphene hybrid interconnects

R Kumar, B Kumari, S Kumar, M Sahoo… - 2020 IEEE Electrical …, 2020 - ieeexplore.ieee.org
To exploit the superior performance of copper and graphene interconnects, hybrid
interconnects are seen as a promising interconnect technology for future technology nodes …

Estimating per-unit-length resistance parameter in emerging copper-graphene hybrid interconnects via prior knowledge based accelerated neural networks

R Kumar, SSL Narayan, S Kumar, S Roy… - 2020 IEEE 29th …, 2020 - ieeexplore.ieee.org
In this paper, an artificial neural network (ANN) is developed to model how the geometrical
parameters of hybrid copper-graphene interconnects affect the per-unit-length resistance …

Performance analysis of self heated multilayer vertical graphene nanoribbon interconnects

B Kumari, R Kumar, M Sahoo… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
In this paper, we report qualitative comparative signal integrity analysis of self-heated Ferric
Chloride (FeCl_3) doped Top Contacted Multilayer Vertical Graphene Nanoribbon (TC …

Electrodeposition of Copper with Ultra-large Grains and Good Conductivity

Y Chen, H Sun, M Li, T Hang - 2023 24th International …, 2023 - ieeexplore.ieee.org
Interconnection resistance has become the main factor restricting high-speed and high-
frequency signal transmission due to the smaller chip size. Preparing copper …

High-Speed Nanoscale Interconnects

S Kumar, MK Majumder - Nanoscale Semiconductors, 2022 - api.taylorfrancis.com
In this chapter, we discuss the important role played by high-speed on-chip, that is,
nanoscale interconnects in the design of integrated circuits and systems. Losses and …

[引用][C] First Principle Analysis of Borophene as an on-chip Interconnect Material

V Agarawal, P Dwivedi, S Kumar, M Poonia - NANO, 2024 - World Scientific
One of the most chemically adaptable elements, boron is found in the periodic table
between two groups ie metals and non-metals and may create more than sixteen …