Advancements in microprocessor architecture for ubiquitous AI—An overview on history, evolution, and upcoming challenges in AI implementation
Artificial intelligence (AI) has successfully made its way into contemporary industrial sectors
such as automobiles, defense, industrial automation 4.0, healthcare technologies …
such as automobiles, defense, industrial automation 4.0, healthcare technologies …
Spiking neural networks hardware implementations and challenges: A survey
M Bouvier, A Valentian, T Mesquida… - ACM Journal on …, 2019 - dl.acm.org
Neuromorphic computing is henceforth a major research field for both academic and
industrial actors. As opposed to Von Neumann machines, brain-inspired processors aim at …
industrial actors. As opposed to Von Neumann machines, brain-inspired processors aim at …
Performance modeling of hyperledger fabric (permissioned blockchain network)
H Sukhwani, N Wang, KS Trivedi… - 2018 IEEE 17th …, 2018 - ieeexplore.ieee.org
Hyperledger Fabric (HLF) is an open-source implementation of a distributed ledger platform
for running smart contracts in a modular architecture. In this paper, we present a …
for running smart contracts in a modular architecture. In this paper, we present a …
Monolithic 3D Integrated circuits: Recent trends and future prospects
Monolithic 3D integration technology has emerged as an alternative candidate to
conventional transistor scaling. Unlike conventional processes where multiple metal layers …
conventional transistor scaling. Unlike conventional processes where multiple metal layers …
CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits
S Bobba, A Chakraborty, O Thomas… - 16th Asia and South …, 2011 - ieeexplore.ieee.org
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential
technology for future gigascale circuits. Since the device layers are processed in sequential …
technology for future gigascale circuits. Since the device layers are processed in sequential …
Performance analysis of 3-D monolithic integrated circuits
S Bobba, A Chakraborty, O Thomas… - 2010 IEEE …, 2010 - ieeexplore.ieee.org
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential
technology for future gigascale circuits. Since the device layers are processed in sequential …
technology for future gigascale circuits. Since the device layers are processed in sequential …
[图书][B] Single Flux Quantum Integrated Circuit Design
G Krylov, EG Friedman - 2024 - Springer
Conventional semiconductor-based digital electronics, with complementary metal oxide
semiconductor (CMOS) technology as the primary example, has experienced meteoric …
semiconductor (CMOS) technology as the primary example, has experienced meteoric …
Closed-form expressions of 3-D via resistance, inductance, and capacitance
I Savidis, EG Friedman - IEEE Transactions on Electron …, 2009 - ieeexplore.ieee.org
Closed-form expressions of the resistance, capacitance, and inductance for interplane 3-D
vias are presented in this paper. The closed-form expressions account for the 3-D via length …
vias are presented in this paper. The closed-form expressions account for the 3-D via length …
Packmerger: A 3d print volume optimizer
We propose an optimization framework for 3D printing that seeks to save printing time and
the support material required to print 3D shapes. Three‐dimensional printing technology is …
the support material required to print 3D shapes. Three‐dimensional printing technology is …
Multilength scale patterning of functional layers by roll-to-roll ultraviolet-light-assisted nanoimprint lithography
Top-down fabrication of nanostructures with high throughput is still a challenge. We
demonstrate the fast (> 10 m/min) and continuous fabrication of multilength scale structures …
demonstrate the fast (> 10 m/min) and continuous fabrication of multilength scale structures …