A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators
J Zhao, Q Yuan, X Kan, J Yang… - … of Micromechanics and …, 2016 - iopscience.iop.org
This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for
radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au–Sn …
radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au–Sn …
A novel 3D encapsulation structure based on subwavelength structure and inserted pyrex glass for RF MEMS infrared detectors
J Zhao, M Ge, C Song, L Sun, H Sun - Electronics, 2019 - mdpi.com
A novel wafer-level three-dimensional (3D) encapsulation structure was designed for radio-
frequency microelectromechanical system (RF MEMS) infrared detectors and investigated …
frequency microelectromechanical system (RF MEMS) infrared detectors and investigated …
High speed test structures for in-line process of 3D system in packaging
G Wang, Z Zhu, Y Xu, R Fang… - 2013 14th International …, 2013 - ieeexplore.ieee.org
As the requirement of portable and smart devices rapidly increasing, applications of high
performance 3D integration and M/NEMS packaging have enormous market potential. High …
performance 3D integration and M/NEMS packaging have enormous market potential. High …
A 3D packaging cover structure with optical filter and low signal-transmission loss for MEMS infrared detectors
GE Mingmin, SUN Haiyan, SUN Ling… - 2019 20th …, 2019 - ieeexplore.ieee.org
This paper presents a wafer-level three-dimensional (3D) packaging cover structure for
microelectromechanical systems (MEMS) infrared detectors. Subwavelength structures with …
microelectromechanical systems (MEMS) infrared detectors. Subwavelength structures with …