Wire bonding is still the most popular chip interconnect technology in microelectronic
packaging and will not be replaced by other interconnect methods for a long time in the …

Copper wire has become a mainstream bonding material in fine-pitch applications due to
the rising cost of gold wire. In recent years, palladium-coated copper (Pd–Cu) wire is being …

There is growing interest in copper (Cu) wire bonding due to its significant cost savings over
gold wire. However, concerns regarding package reliability and corrosion susceptibility have …

Recently, a shift from Au bonding wire to Cu bonding wire is expected for automotive
application. Palladium coated copper (PCC) wire is strong candidate since it is widely used …

In this paper, we present studies for the new gold-palladium coated copper wire" EX1R" with
focus to application in the automotive industry. This wire material was developed to prevent …

In this paper, the growth kinetics of Cu–Al intermetallic compounds formed during isothermal
annealing of Pd–Cu wire bonds with different palladium distribution at 175° C are …

In this study, the degradation of copper wire under high temperature and high humidity is
investigated. Unbiased high temperature and high humidity accelerated stress test (uHAST) …

The temperature-dependence mechanical characteristics of 4N Cu wire with 25, 30 and 38
μm diameters are investigated via the utilization of micro-tensile tests. Measured data …

We present studies for a newly developed gold-palladium coated copper wire with focus to
the automotive industry. This wire material was designed to prevent halide induced interface …

Cu wire bonding has taken over Au wire bonding due to its cost savings and other
performance advantages such as higher mechanical strength for complex looping and better …