The purpose of this paper is to obtain the development direction for improving the reliability
of bond wires effectively in power electronics through overviewing the state-of-the-art of the …

CMOS-based microsensors benefit from well-established fabrication technologies and the
possibility of on-chip circuitry. In these devices, added on-chip functionality can be …

This paper reports the design, fabrication, and characterization of a two-dimensional stress-
sensor array based on a stress-sensor element exploiting the transverse pseudo-Hall effect …

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used
previously to describe the interfacial stick-slip motion as the most important mechanism in …

Free air ball (FAB) and bonded strength were performed on an Ag-10Au-3.6 Pd alloy
bonding wire (diameter of 0.025 mm) for different electronic flame-off (EFO) currents, times …

Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process
used extensively in the microelectronics industry for interconnections to integrated circuits …

采集键合试验的PZT 驱动功率及对应键合点的剪切测试力数据, 作为超声功率和引线键合强度的
表征. 试验中的键合力, 温度和时间分别设置为4.7 N, 室温和100 ms. 在这种典型的工业工艺键 …

The ultrasonic transversal force transmitted to a chip during ultrasonic bonding is derived
from measurements of the vibration amplitude at the tool tip and the die edge. To proof the …

The physics describing ultrasonic wire bonding is only partly known. A better understanding
how bond strength depends on process parameters could increase productivity by speeding …