A stacked microelectronic assembly is fabricated from a structure which includes a plurality
of first microelectronic elements having front faces bonded to a carrier. Each first …

Precursor compositions for the deposition of electronic fea tures such as resistors and
dielectric components and methods for the deposition of the precursor compositions. The …

(57) ABSTRACT A precursor composition for the deposition and formation of an electrical
feature Such as a conductive feature. The precursor composition advantageously has a low …

(57) ABSTRACT A precursor composition for the deposition and formation of an electrical
feature Such as a conductive feature. The precursor composition advantageously has a …

An electrical conductor formed from one or more metallic inks. The electrical conductor
comprises a network of inter connected metallic nodes. Each node comprises a metallic …

A metal nanoparticle composition for the fabrication of conductive features. The metal
nanoparticle composition advantageously has a low viscosity permitting deposition of the …

Precursor compositions in the form of a tape that can be transferred to a substrate and
converted to an electronic fea ture at a relatively loW temperature, such as not greater than …

Precursor compositions having a loW conversion tempera ture and methods for the
fabrication of recessed electrical features from the precursor compositions. The electrical …

A stacked microelectronic assembly is provided which includes first and second stacked
microelectronic elements. Each of the first and second microelectronic elements can include …

The object of the present invention is to provide a drive circuit for at least one light-emitting
diode with which the brightness of the light-emitting diodes can be regulated in a low-loss …