Research progress of interfacial design between thermoelectric materials and electrode materials

W Le, W Yang, W Sheng, J Shuai - ACS Applied Materials & …, 2023 - ACS Publications
Intensive efforts have been conducted to realize the reliable interfacial joining of
thermoelectric materials and electrode materials with low interfacial contact resistance …

Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Y Zhang, H He, C Niu, Y Wu, M Liu, S Liu… - … Applied Materials & …, 2023 - ACS Publications
As a result of the complexity and difficulty of the lifetime assessment of the thermoelectric
(TE) module, the related research is still immature. In this work, to predict the lifetime of the …

Diffusion bonding at the interface of Bi2Te3 thermoelectric modules

YN Nguyen, I Son - Materials Chemistry and Physics, 2022 - Elsevier
Abstract In production of Bi 2 Te 3-based thermoelectric modules, Bi 2 Te 3 materials were
coated with electroless nickel (EN), electroless palladium, and immersion gold multilayers to …

Performance Degradation and Protective Effects of Atomic Layer Deposition for Mg‐based Thermoelectric Modules

P Ying, RB Villoro, A Bahrami, L Wilkens… - Advanced Functional …, 2024 - Wiley Online Library
Thermoelectric technology has witnessed a resurgence in recent years due to increasing
demands for sustainable energy sources and efficient cooling systems. Recently, the …

Bulk Bi2Te3-based bendable thermoelectric device with highly elastic Cu-Be alloy foils

YN Nguyen, J Park, SH Bae, D Kim, KQ Dang… - Materials Today …, 2023 - Elsevier
Abstract The binary Cu-Be alloy features high elasticity and yield strength. Hence, it can be
used as an electrode material for bulk Bi 2 Te 3-based thermoelectric (TE) devices to create …

Study on the Preparation and Properties of a Co-Based Barrier Layer by Diffusion Welding

S Jiang, Z Kuang, X Hu, X Chen, F Zou… - Journal of Electronic …, 2024 - Springer
In order to improve the stability of Bi2Te3-based thermoelectric devices, we attempted to
prepare a barrier layer via diffusion welding using Co powder as the barrier materials. The …

Effect of NiMo diffusion barrier plating preparation on microstructure and properties of Bi2Te3/Cu joints

L Zhang, J Bu, Z Sun, S Liu, H Geng, Q Chang… - Materials Science and …, 2024 - Elsevier
Abstract Bismuth telluride (Bi 2 Te 3) thermoelectric devices play a significant role in
recovering low-grade waste heat. While for Bi 2 Te 3/Cu joints, excessive interfacial reaction …

Product Identification of Bismuth Telluride by Nitric Acid Corrosion

S Jiang, Z Luo, X Hu, X Chen, F Zou, X Fan - Journal of Electronic …, 2023 - Springer
Bismuth telluride-based thermoelectric devices are the only thermoelectric devices that are
currently used in large-scale commercial applications. In actual production, nitric acid …

Interfacial Intermetallic Compounds of Bi2Te3/Cu joint using SAC305 solder and nano-Ag paste

S Pak, H Tatsumi, J Wang… - … on Electronics Packaging …, 2023 - ieeexplore.ieee.org
Sn-3Ag-0.5 Cu (SAC305) solder and nano-Ag paste were used as bonding materials to
combine Bi2Te3-based thermoelectric materials with Cu or ENIG-Cu electrodes. To …