Ultraviolet light-emitting diodes (UV-LEDs) have drawn considerable attention in
environment, life science, and industry fields, such as the applications of near UV-LEDs in …

Wafer bonding techniques, which are very different from epitaxial growth techniques, can be
used not only for the fabrication of micro-electromechanical systems (MEMS), silicon on …

We have developed a single-wafer vacuum encapsulation for microelectromechanical
systems (MEMS), using a thick (20-mum) polysilicon encapsulation to package …

This study investigated the transient transport phenomenon during the pile up of molten lead-
free solder via the inkjet printing method. With regard to the droplet impact velocity, the …

Although there is increasing need for modeling and simulation in the IC package design
phase, most assembly processes and various reliability tests are still based on the time …

Induction heating is widely used in aviation, communication, and new energy fields due to its
advantages of non-contact, high-power, and controllable heating depth. However, it is still …

Compression cold welding methods, joint structures, and hermetically sealed containment
devices are provided. The method includes providing a first substrate having at least one …

In this study, silicon wafers were bonded using Ni/Al reactive multilayer foils as local heat
sources for melting solder layers. Exothermic reactions in Ni/Al reactive multilayer foils were …

The recent evolution of microelectromechanical systems (MEMSs) presents a more mature
technology that expands from pure research towards multidisciplinary …

Because of unique water properties, humidity affects materials and many living organisms,
including humans. Humidity control is important in various fields, from production …